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Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A computational model is developed to predict the performance of phase change materials(PCMs) for passive thermal control of electronic modules during transient power variations or following an ...
Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the present paper, a methodology is described for the integrated thermal analysis of a laminar natural convection air cooled nonventilated electronic system. This approach is illustrated by ...
Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A computational study of natural convection in an enclosure as applied to applications in cooling of electronic components is reported. The investigation is for a configuration consisting of a ...
Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Steady, laminar flow and heat transfer, inside a rectangular microchannel with a dimpled bottom surface, are numerically studied. The microchannel is 50×10−6m(50μm) deep and 200×10−6m(200μm) ...